Processing Technology Of Granite Platform And Component Products
The gap processing of granite precision platform and component products is simple and easy to obtain high precision. It is easy to obtain high precision and surface roughness through grinding and polishing, unlike metal parts requiring complex sanding, forging or heat treatment processes, and ceramic parts requiring pressing, forming, sintering and other processes.
Therefore, the processing equipment is simple, the processing cycle is short, the yield is high and the processing cost is low. At 1200mm × Taking the 800mm granite platform as an example, the processing accuracy can be achieved in only half a month from the blank to the finished product, and the flatness can reach 2.5 μ m. It takes at least one to two years for other materials of the same size to achieve such accuracy.
The blank of granite precision platform and component products is first cut into the required size by diamond circular saw blade. The processing plane usually needs to be grinded and polished by grinding wheel in several processes. Higher precision must be obtained by manual grinding with gray cast iron grinding tool and silicon carbide abrasive. When slotting is required, the corresponding milling head shall be selected, and the diamond coring bit shall be used for drilling.
There are two detection methods:
1. One is with an accuracy of 0.5 μ M electronic level, which can detect straightness by displacement method and flatness by manufacturing method. The measured results can be converted by algorithm to obtain the specific values of straightness and flatness; It is characterized by low accuracy, but reliable measurement data and no '0' point drift. It is especially suitable for on-line measurement and detection.
2. Another method of measuring straightness can be passed with an accuracy of 0.1 μ The capacitance micrometer of M is measured by displacement method, and the indication value of its meter is the error value of straightness; In this measurement, the '0' point drift of the inductance micrometer itself is serious, and its value can be trusted only after 24 hours of stability. Therefore, the connection time between processing and measurement increases. Higher precision processing must have higher-level precision detection means. At present, HP5528A or HP5529A dynamic calibrator is often used. Its display accuracy is 1nm, which can detect flatness, perpendicularity, straightness, time base vibration, angular displacement measurement, diagonal measurement, etc.
The detection accuracy of the dynamic calibrator is particularly high, but due to its complex optical system and complex debugging procedures, especially the light intensity and of the return beam of the optical appliance are guaranteed to be more than 80%, otherwise the beam will be blocked, which is difficult for the debugger, the debugging time is long, and the debugging method is not easy to master. At the same time, it requires a high measurement environment.
